Problem: Bonding and debonding of silicones and transparent plastics are essential processes to mechanically support next generation of wafers, which are critical for 3D integrated circuits as well as for handling delicate substrates such as compound semiconductors or lab-on-chips. Currently, debonding processes can be performed either mechanically, thermally or with UV light, but these processes require additional materials and many cost-intensive process steps. Currently, the lack of a truly suitable tool limits the material development necessary to produce the next generation of chips.

Solution: RayVen offers the swiss knife for material processing: When it comes to the development of innovative materials for (sustainable) production processes, a decisive factor is whether and how they can be processed industrially. Traditional lasers are adapted for processing specific materials. RayVen's 2.1 μm lasers represent a disruptive advance in materials processing, offering unparalleled precision and versatility for processing a whole range of different materials. RayVen lasers enable effortless examination of delicate structures, make minute changes at record speed and are barely absorbed by air or water. 
The innovation comes from two major technical revolutions: the use of a new laser amplification medium and the use of Semiconductor Saturable Absorber Mirrors (SESAMs) for 2.1-μm high-power lasers. RayVen's new, unique range of 2.1-μm ultrafast lasers has the potential to revolutionize materials processing by exploiting either the transmission or absorption characteristics of different materials at 2.1 μm.

Ultra-fast 2.1-μm lasers are ideal for in-chip processing of silicon due to the transparency and 2-photon absorption. The photon energy of 2.1-μm lasers corresponds to half the band gap energy of silicon. This enables changes inside silicon wafers without heat absorption along the path. Micromachining of plastics with lasers is another fast-growing technology for producing small and complex parts with high precision. It is a versatile and cost-effective process that can be used for a variety of applications, including medical devices such as lab-on-chips or in-chip organs, electronic components and consumer goods. However, these materials are transparent to conventional ultrashort pulse lasers. RayVen's 2.1-μm ultrafast laser can reach exactly the absorption peak of PC and PE, so that it would be possible to work significantly more efficiently with a low pulse energy.

USP: 2,1µm wavelenght watt level laser with low noise served in a simple system.